370-AEVU: Dell 256GB DDR4-3200 Octal Rank 3DS LRDIMM Memory Module
Also listed as: 08M90J, 8M90J, M386A2G40AM0-CWE · made by Samsung
The Dell 370-AEVU is a Dell 256GB DDR4-3200 Octal Rank 3DS LRDIMM Memory Module providing 256GB capacity at DDR4-3200 across a 8Rx4 (3DS) 288-pin 3DS LRDIMM layout. Manufactured with Samsung DRAM dies for part 370-AEVU, it delivers error-correcting memory performance for Dell PowerEdge R750, R650, R7525, R6525 servers.
Specifications
| Part number | 370-AEVU |
|---|---|
| Brand | Dell |
| Made by | Samsung |
| Type | Memory |
| Other numbers | 08M90J, 8M90J, M386A2G40AM0-CWE |
| Status | current |
| Capacity (GB) | 256 |
| Speed | DDR4-3200 |
| Rank width | 8Rx4 (3DS) |
| Form factor | 288-pin 3DS LRDIMM |
| Tdp (W) | 16 |
About the 370-AEVU
The Dell 370-AEVU is a Dell 256GB DDR4-3200 Octal Rank 3DS LRDIMM Memory Module providing 256GB of system memory operating at DDR4-3200 in a 8Rx4 (3DS) 288-pin 3DS LRDIMM configuration. Built with tier-1 Samsung DRAM silicon, the 370-AEVU integrates Error-Correcting Code architecture to detect and correct single-bit memory faults in hardware. In Dell's memory portfolio, 370-AEVU provides dependable memory capacity and channel bandwidth for multi-tenant hypervisors, database servers, and HPC compute nodes.
Compatibility
The 370-AEVU module installs into standard 288-pin DIMM sockets across Dell PowerEdge platforms including R750, R650, R7525, R6525. Populating 370-AEVU requires adherence to platform channel balancing rules, and mixing Registered RDIMMs with Load-Reduced LRDIMMs or unbuffered memory within the same system is prohibited. Operating speed of the 370-AEVU is governed by processor capabilities, auto-negotiating to supported memory bus frequencies.
How to identify a genuine unit
Genuine Dell 370-AEVU memory modules carry a serialized manufacturer label displaying DP/N 08M90J, 256GB 8Rx4 (3DS) DDR4-3200 specifications, and Samsung factory markings such as M386A2G40AM0-CWE. In iDRAC System Memory inventory, the 370-AEVU module registers with verified Dell SPD profiles, serial number, and rank configuration. Physical DIMM PCBs on the 370-AEVU feature gold-plated edge contacts with standard anti-static substrate coatings.
Buying used
When inspecting pre-owned 370-AEVU memory modules, examine the edge connector contacts for scratches, bent traces, or missing surface bypass capacitors. Run Dell ePSA embedded diagnostics or Memtest86+ across all 370-AEVU channels to verify zero single-bit or multi-bit ECC errors under maximum memory stress. Ensure all 370-AEVU modules installed within the same memory channel share matching ranks, capacities, and part numbers.
Fits these models
Equivalent part numbers
- Samsung M386A2G40AM0-CWE Samsung 256GB DDR4-3200 3D Through-Silicon-Via LRDIMM OEM base
FAQ
What is TSV / 3DS memory technology?
3D-Stacked (3DS) memory uses Through-Silicon Vias to connect stacked DRAM dies vertically, reducing trace capacitance and enabling 256GB single-DIMM density.
Can a server run on a single 256GB DIMM?
Yes, although populating all memory channels evenly is required to obtain full memory bandwidth.
Buying or selling 370-AEVU?
New, refurbished or used. Tell us the quantity and condition and we connect you with a vetted reseller in your region, usually within one working day.
Sources
- Dell 256GB DDR4-3200 3DS LRDIMM Memory Specifications, checked 2026-10-27