P06039-B21: HPE 256GB (1x256GB) Octal Rank x4 DDR4-3200 CAS-26-22-22 Load Reduced 3DS Smart Memory Kit

Also listed as: P06039-001, P21678-001, P11448-0A1, M386AAG40MMB-CWE · made by Samsung

The HPE P06039-B21 is an ultra-dense 256GB octal-rank (8Rx4) 3DS load-reduced DDR4 memory module running at 3200 MT/s with CL26 timings. Designed for massive scale multi-tenant virtualization clusters, large-scale Redis in-memory caches, and mission-critical SAP HANA installations on HPE ProLiant Gen10 Plus platforms, it utilizes 3-dimensional through-silicon via (TSV) stacking. When inspecting pre-owned 3DS modules, verify SPD authentication in iLO and monitor thermal sensors during burn-in testing.

Specifications

About the P06039-B21

P06039-B21 is HPE's pinnacle 256GB octal-rank (8Rx4) DDR4-3200 3DS Load-Reduced DIMM (LRDIMM) SmartMemory kit operating at 1.2V with CL26 timings. It represents the highest density DDR4 module ever produced for x86 enterprise servers, utilizing Three-Dimensional Stacking (3DS) technology with Through-Silicon Vias (TSVs) to vertically integrate multiple DRAM silicon dies into a single package. It enables massive memory densities—up to 8TB of high-speed RAM in a dual-socket server—specifically designed for multi-terabyte in-memory SAP HANA databases, hyperscale virtualization clusters, and high-performance financial modeling.

Compatibility

This 3DS LRDIMM is strictly compatible with HPE ProLiant Gen10 Plus servers, such as the DL360 Gen10 Plus, DL380 Gen10 Plus, DL385 Gen10 Plus v2, and DL325 Gen10 Plus v2, powered by 3rd Generation Intel Xeon Scalable processors (Ice Lake) or AMD EPYC 7003 series processors. It will NOT operate in standard Gen10 (non-Plus) servers or Gen9 systems due to memory controller architecture constraints. Furthermore, 3DS LRDIMMs cannot be mixed with standard RDIMMs or non-3DS LRDIMMs. The option part number is P06039-B21, with spare numbers P06039-001 and P21678-001.

How to identify a genuine unit

An authentic P06039-B21 is easily recognized by its distinctive, taller physical profile with dual heat-spreader thermal shielding and prominent TSV stack markings, alongside the HPE SmartMemory holographic label and Samsung OEM label (model M386AAG40MMB-CWE). In iLO 5, the module reports as an authenticated 256GB Octal-Rank 3DS LRDIMM with valid cryptographic signatures. Unauthenticated grey-market modules lack HPE SPD programming and will cause system POST halt or memory downclocking.

Buying used

Because of the extreme cost and thermal density of 256GB 3DS modules, thorough verification is vital when purchasing pre-owned stock. Run extended memory stress diagnostics under HPE SSA or Linux mcelog to ensure zero correctable or uncorrectable TSV bus errors across all eight logical ranks. Inspect the heat spreader assembly to confirm it has not been detached or deformed, verify that contact pins are free of oxidation, and ensure the server chassis provides high-performance fan kits to maintain required airflow.

Reference prices (last 12 months, updated 2026-10-27)

Prices seen on public listings on the dates shown, before tax and shipping. Not an offer.

Fits these models

• HPE ProLiant DL380 Gen10 Plus
• HPE ProLiant DL360 Gen10 Plus
• HPE ProLiant DL385 Gen10 Plus v2
• HPE ProLiant DL325 Gen10 Plus v2

Equivalent part numbers

• Samsung M386AAG40MMB-CWE Samsung OEM 256GB 8Rx4 PC4-3200AA 3DS LRDIMM bare module

FAQ

Sources

• HPE DDR4 SmartMemory 256GB 3DS LRDIMM Kit, checked 2026-10-27